esmt ad82586c elite semiconductor memory technology inc./elite micropower inc . publication date:nov. 2013 revision: 0.1 1/51 2x20w stereo digital audio amplifier with 20 bands eq functions features ? 16/18/20/24-bits input with i 2 s, left-alignment and right-alignment data format ? psnr & dr(a-weighting) loudspeaker: 99db (psnr), 104db (dr) @24v ? multiple sampling frequencies (fs) 32khz / 44.1khz / 48khz and 64khz / 88.2khz / 96khz and 128khz / 176.4khz / 192khz ? system clock = 64x, 128x, 192x, 256x, 384x, 512x, 576x, 768x, 1024x fs 64x~1024x fs for 32khz / 44.1khz / 48khz 64x~512x fs for 64khz / 88.2khz / 96khz 64x~256x fs for 128khz / 176.4khz / 192khz ? supply voltage 3.3v for digital circuit 10v~26v for loudspeaker driver ? loudspeaker output power for at 24v 10w x 2ch into 8 ? @0.17% thd+n for stereo 20w x 2ch into 8 ? @0.26% thd+n for stereo ? sound processing including 20 bands parametric speaker eq volume control (+24db~-103db, 0.125db/step), dynamic range control (drc) dual band dynamic range control power clipping 3d surround sound channel mixing noise gate with hysteresis window bass/treble tone control dc-blocking high-pass filter ? anti-pop design ? short circuit and over-temperature protection ? i 2 c control interface with selectable device address ? support hardware and software reset ? internal pll ? lv under-voltage shutdown and hv under-voltage detection ? power saving mode applications ? tv audio ? boom-box, cd and dvd receiver, docking system ? powered speaker ? wireless audio description ad82586c is a digital audio amplifier capable of driving a pair of 8 ? , 20w operating at 24v supply without external heat-sink or fan requirement with play music. ad82586c can provide advanced audio processing capabilities, such as volume control, 20 bands speaker eq, audio mixing, 3d surround and dynamic range control (drc). these functions are fully programmable via a simple i 2 c control interface. robust protection circuits are provided to protect ad82586c from damage due to accidental erroneous operating condition. ad82586c is more tolerant to noise and pvt (process, voltage, and temperature) variation than the analog class-ab or class-d audio amplifier counterpart implemented by analog circuit design. ad82586c is pop free during instantaneous power switch because of its built-in, robust anti-pop circuit.
esmt ad82586c elite semiconductor memory technology inc./elite micropower inc . publication date:nov. 2013 revision: 0.1 2/51 pin assignment pin description pin name type description characteristics 1 pd i power down, low active schmitt trigger ttl input buffer 2 error o error status, low active open-drain output 3 sdata i serial audio data input schmitt trigger ttl input buffer 4 lrcin i left/right clock input (fs) schmitt trigger ttl input buffer 5 sda i/o i 2 c bi-directional serial data schmitt trigger ttl input buffer 6 scl i i 2 c serial clock input schmitt trigger ttl input buffer 7 reset i reset, low active schmitt trigger ttl input buffer 8 dgnd p digital ground 9 dvdd p digital power 10 sa0 i i 2 c select address 0 schmitt trigger ttl input buffer 11 mclk i master clock input schmitt trigger ttl input buffer 12 bclk i bit clock input (64fs) schmitt trigger ttl input buffer 13 vddra p right channel supply a 14 n.c. nc 15 ra o right channel output a 16 gndr p right channel ground 17 rb o right channel output b 18 vddrb p right channel supply b 19 vddlb p left channel supply b 20 lb o left channel output b 21 gndl p left channel ground 22 la o left channel output a 23 n.c. nc 24 vddl p left channel supply a
esmt ad82586c elite semiconductor memory technology inc./elite micropower inc . publication date:nov. 2013 revision: 0.1 3/51 functional block diagram sa1 reset pd sa0 sda scl mclk ordering information product id package packing / mpq comments AD82586C-QG24NAT e-tssop 24l 62 units / tube 100 tubes / small box green available package package type device no. ja ( /w) jt ( /w) jt ( /w) exposed thermal pad e-tssop 24l ad82586c 26.8 0.24 27.1 yes (note1) note 1.1: the thermal pad is located at the botto m of the package. to optimize thermal performance, soldering the thermal pad to the pcb?s ground plane is suggested. note 1.2: ja , the junction-to-ambient thermal resistan ce is simulated on a room temperature (t a =25 ), natural convection environment test board, which is constr ucted with a thermally efficient, 4-layers pcb (2s2p). the simulation is tested using t he jesd51-5 thermal me asurement standard. note 1.3: jt represents the thermal parameter for the heat flow between the chip junction and the package?s top surface center. it?s extracted from the simulation data for obtaining ja , using a procedure described in jesd51-2. note 1.4: jt represents the thermal resistance for the heat flow between the chip junction and the package?s top surface. it?s extracted from the simulation dat a with obtaining a cold plate on the package top. absolute maximum ratings stresses beyond those listed under absolute maximum ratings (<100msec) may cause permanent damage to the device. symbol parameter min max units vddl/r supply for driver stage -0.3 30 v dvdd supply for digital circuit -0.3 3.6 v v i input voltage -0.3 3.6 v t stg storage temperature -65 150 o c t j junction operating temperature 0 150 o c
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